What is thermal resistance of each package?

θja, the junction to case thermal resistance(not mounted on board), θja, the junction to ambient thermal resistance(mounted on board), and the junction to case thermal resistance, of each package are as follows. As thermal resistance varies depending on the lead frame material and die size, the data must be handled taking the test conditions into consideration.

Please refer to the package data book

Package code	θja(℃/W) Not mounted on board	θja(℃/W) Mounted on board
MP-26DT	125	78
FP-44A	121	102
FP-64	111	87
FP-64A	118	103
FP-64H	94	60
FP-80	98	88
FP-80A	115	99
FP-80Q	94	58
FP-100	97	88
FP-100B	107	80
FP-100M	99	58
FP-100M	86	47
FP-112	82	-
FP-112B	74	54
FP-128	93	63
FP-136	88	73
FP-144G	65	45
FP-144G	57	37
FP-144J	100	64
FP-144J	75	45

In addition, RENESAS does not guarantee these parameters. Please use these values only for your reference.