What is thermal resistance of each package?
Latest Updated:03/25/2009
Question:
What is thermal resistance of each package?
Answer:
θja, the junction to case thermal resistance(not mounted on board), θja, the junction to ambient thermal resistance(mounted on board), and the junction to case thermal resistance, of each package are as follows. As thermal resistance varies depending on the lead frame material and die size, the data must be handled taking the test conditions into consideration.
Please refer to the package data book
Package code
|
θja(℃/W)
Not mounted on board |
θja(℃/W)
Mounted on board |
MP-26DT
|
125
|
78
|
FP-44A
|
121
|
102
|
FP-64
|
111
|
87
|
FP-64A
|
118
|
103
|
FP-64H
|
94
|
60
|
FP-80
|
98
|
88
|
FP-80A
|
115
|
99
|
FP-80Q
|
94
|
58
|
FP-100
|
97
|
88
|
FP-100B
|
107
|
80
|
FP-100M
|
99
|
58
|
FP-100M
|
86
|
47
|
FP-112
|
82
|
-
|
FP-112B
|
74
|
54
|
FP-128
|
93
|
63
|
FP-136
|
88
|
73
|
FP-144G
|
65
|
45
|
FP-144G
|
57
|
37
|
FP-144J
|
100
|
64
|
FP-144J
|
75
|
45
|
In addition, RENESAS does not guarantee these parameters. Please use these values only for your reference.
Suitable Products
H8/300H Tiny |
H8/36109 |
H8/36087 |
H8/36077, H8/36079 |
H8/36064 |
H8/36049 |
H8/36037, H8/36057 |
H8/36014, H8/36024 |
H8/3694 |
H8/3687 |
H8/3672 |
H8/3664 |
H8/36912, H8/36902 |